Top Source-China Electronic Components Supplier edit——NXP
Semiconductors yesterday announced its collaboration with TSMC to
deliver the industry’s first automotive embedded MRAM (Magnetic Random
Access Memory) in 16 nm FinFET technology. As automakers transition to
software-defined vehicles (SDVs), they need to support multiple
generations of software upgrades on a single hardware platform. Bringing
together NXP’s high-performance S32 automotive processors with fast and
highly reliable next-generation non-volatile memory in 16 nm FinFET
technology provides the ideal hardware platform for this transition.
MRAM can update 20MB of code in ~3 seconds compared to flash
memories that take about 1 minute, minimizing the downtime associated
with software updates and enabling carmakers to eliminate bottlenecks
that arise from long module programming times. Moreover, MRAM provides a
highly reliable technology for automotive mission profiles by offering
up to one million update cycles, a level of endurance 10x greater than
flash and other emerging memory technologies.
SDVs enable carmakers to roll out new comfort, safety and
convenience features via over-the-air (OTA) updates, extending the life
of the vehicle and enhancing its functionality, appeal, and
profitability. As software-based features become more widespread in
vehicles, the frequency of updates will increase, and MRAM’s speed and
robustness will become even more important.
TSMC’s 16FinFET embedded MRAM technology exceeds the rigorous
requirements of automotive applications with its one-million cycle
endurance, support for solder reflow, and 20-year data retention at
150°C.
“The innovators at NXP have always been quick to recognize the
potential of TSMC’s new process technologies, especially for demanding
automotive applications. We’re excited to see our leading MRAM
technology employed in NXP’s S32 platform to enable the coming
generation of software-defined vehicles,” said Kevin Zhang, Senior Vice
President of Business Development at TSMC.
“NXP’s successful collaboration with TSMC spans decades and has
consistently delivered high quality embedded memory technology to the
automotive market. MRAM is a breakthrough addition to NXP’s S32
automotive solution portfolio supporting next-generation vehicle
architectures,” said Henri Ardevol, Executive Vice President and General
Manager of Automotive Processing at NXP.
Test vehicle samples are complete and in evaluation. Initial product
samples are scheduled for lead customer availability in early 2025.
Find the part number you need in stock